Semiconductor Wafer Slicing Diamond Saw from Japan
A semiconductor wafer slicing diamond saw is a diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. It is essential wafer preparation machinery of heading 84.28, and its parts are classified as 'other' under tariff item 8431.39.00.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the saw as a complete machine of heading 84.28 if imported whole, or its parts under 8431.39.00 if separate
• Provide a detailed description of the slicing process to the CBSA
• Check if the saw qualifies for the Machinery Remission Program