Semiconductor Wafer Slicing Diamond Saw from China
A diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. It is essential wafer preparation machinery of heading 84.28, and its parts are classified as 'other' under 8431.39.00.
Duty Rate — China → Canada
0%
Import Tips
• Classify the saw as a part of machinery of heading 84.28, with evidence of its use in semiconductor wafer preparation
• Provide a detailed description of the saw's operation to the CBSA
• Check if the saw qualifies for duty-free entry under a free trade agreement by providing a certificate of origin