Wafer Slicing Saw Pulley Drive from United States
Pulley and drive components for high-precision diamond saws that slice monocrystalline boules into semiconductor wafers. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically pulleys used in wafer slicing saws.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm that the pulley drive is a part of machinery of heading 84.25 and not a complete machine
• Provide technical specifications to the CBSA to support the classification
• Check if the pulley is imported with other components that may affect the tariff classification