Semiconductor Wafer Slicing Saw Drive Pulley
A precision drive pulley for diamond wire wafer slicing saws that cut monocrystalline boules into semiconductor wafers. This pulley is a part of the capstan or winch machinery of heading 84.25, as it guides and drives the wire under tension. It ensures accurate and consistent wire movement for precise slicing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the pulley is a standard transmission pulley not specific to wafer slicing saws
General pulleys are classified under heading 84.83 as transmission elements.
If the pulley is part of a complete slicing saw classified under heading 84.64
Complete machine tools for working stone or similar materials are classified in heading 84.64.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document the pulley's role in the slicing saw's wire tensioning system to justify classification under 8431.10.00
• Ensure the pulley is described as a part of machinery of heading 84.25 on the customs declaration
• Consider whether the pulley could be classified as a general pulley under heading 84.83 if not clearly dedicated
Related Products under Tariff item 8431.10.00
Boule Flattener Drive Capstan
A drive capstan for grinding flats on crystal boules to indicate conductivity type. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstans used in semiconductor boule grinding equipment.
Boule Wafer Edge Profiling Tool
A diamond wheel assembly for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. This assembly is a part of the machinery of heading 84.25, as it is used in wafer preparation equipment that performs lifting or hoisting functions. It ensures chip-free rounded edges for fab processing.
CMP Polisher Carrier Capstan
A capstan for chemical mechanical polishing carriers in wafer planarization. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstans used in CMP polishing equipment.
CMP Polisher Platen Assembly
A rotating platen that holds the polishing pad in chemical mechanical planarization (CMP) tools for wafers. This platen is a part of the machinery of heading 84.25, as it is an integral component of wafer polishers that use hoisting or lifting mechanisms. It ensures uniform pressure distribution for consistent polishing.
Crystal Boule Grinder Capstan Drum
A rotary capstan drum for crystal grinders that shape semiconductor boules to precise wafer diameters and flats indicating conductivity. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstan drums used in semiconductor boule grinding.
Crystal Boule Grinder Hoist Assembly
A hoist assembly integrated with crystal boule grinders to precisely shape semiconductor crystal boules to wafer diameters and add conductivity flats. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically hoists used in semiconductor manufacturing.