Semiconductor Wafer Polishing Head from United States
A carrier head assembly that holds wafers against polishing pads in chemical mechanical planarization (CMP) tools, producing mirror-finish surfaces. This polishing head is a critical part of wafer polishers classified under heading 84.25, achieving atomic-level flatness. It is classified under tariff item 8431.10.00 as a part of machinery of heading 84.25.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the polishing head is declared as a part of CMP tools of heading 84.25, with technical specifications showing its sole or principal use
• If the head incorporates pneumatic or hydraulic mechanisms, verify that these do not change classification
• Keep documentation of the machine it is designed for, in case CBSA requests verification