Precision Wafer Grinder Feed Winch
A feed winch that controls the grinding depth in precision wafer grinders used for semiconductor manufacturing. This winch is a part of the hoisting or lifting machinery of heading 84.25, as it raises and lowers the grinding head with high precision. It ensures consistent material removal during the wafer thinning process.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as a complete winch rather than a part
Complete winches are classified under heading 84.25, while parts are classified under heading 84.31.
If the winch is essentially a shaft without the full winch mechanism
Transmission shafts are classified under heading 84.83 when not identifiable as parts of a specific machine.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify this winch as a part of machinery of heading 84.25 and be prepared to show its specific design for wafer grinders
• Keep records of the winch's specifications to support the classification if questioned by CBSA
• Check if the winch is eligible for duty-free entry under a trade agreement based on its origin
Related Products under Tariff item 8431.10.00
Boule Flattener Drive Capstan
A drive capstan for grinding flats on crystal boules to indicate conductivity type. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstans used in semiconductor boule grinding equipment.
Boule Wafer Edge Profiling Tool
A diamond wheel assembly for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. This assembly is a part of the machinery of heading 84.25, as it is used in wafer preparation equipment that performs lifting or hoisting functions. It ensures chip-free rounded edges for fab processing.
CMP Polisher Carrier Capstan
A capstan for chemical mechanical polishing carriers in wafer planarization. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstans used in CMP polishing equipment.
CMP Polisher Platen Assembly
A rotating platen that holds the polishing pad in chemical mechanical planarization (CMP) tools for wafers. This platen is a part of the machinery of heading 84.25, as it is an integral component of wafer polishers that use hoisting or lifting mechanisms. It ensures uniform pressure distribution for consistent polishing.
Crystal Boule Grinder Capstan Drum
A rotary capstan drum for crystal grinders that shape semiconductor boules to precise wafer diameters and flats indicating conductivity. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstan drums used in semiconductor boule grinding.
Crystal Boule Grinder Hoist Assembly
A hoist assembly integrated with crystal boule grinders to precisely shape semiconductor crystal boules to wafer diameters and add conductivity flats. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically hoists used in semiconductor manufacturing.