Double-Sided Wafer Lapper Winch from Japan
A winch for simultaneous double-sided lapping of semiconductor wafers. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically winches used in wafer lapping equipment.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm that the winch is a part of machinery of heading 84.25 and not a complete machine
• Provide technical specifications to the CBSA to support the classification
• Check if the winch is imported with other components that may affect the tariff classification