Double-Sided Wafer Lapper Winch from Japan
A winch for simultaneous double-sided lapping of semiconductor wafers. This is a part of machinery of heading 84.25, specifically designed for use with wafer lapping equipment.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the winch is declared as a part of machinery of heading 84.25, not as a standalone winch
• Provide technical specifications showing its dedicated use with wafer lappers
• Verify if the item qualifies for any trade agreement preferential rates