Wafer Lapping Machine from Mexico
A machine that projects abrasive slurry onto rotating lapping plates to achieve ultra-flat semiconductor wafer surfaces for fabrication. It is classified under this tariff item as an 'other' appliance for dispersing liquids or powders, as it is not a machine-tool of heading 84.64 or a semiconductor machine of 84.86.
Duty Rate — Mexico → Canada
0%
Import Tips
• If the lapping machine performs the lapping function itself (not just slurry dispensing), it may be classified under 84.86 or 84.64 — confirm with CBSA
• Provide details of the slurry projection system to support 84.24 classification
• Check if the abrasive slurry requires import permits under Canadian regulations