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8424.89.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

A machine that projects abrasive slurry onto rotating lapping plates to achieve ultra-flat semiconductor wafer surfaces for fabrication. It is classified under this tariff item as an 'other' appliance for dispersing liquids or powders, as it is not a machine-tool of heading 84.64 or a semiconductor machine of 84.86.

Duty Rate — Japan → Canada

0%
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Import Tips

• If the lapping machine performs the lapping function itself (not just slurry dispensing), it may be classified under 84.86 or 84.64 — confirm with CBSA

• Provide details of the slurry projection system to support 84.24 classification

• Check if the abrasive slurry requires import permits under Canadian regulations

Wafer Lapping Machine from Japan — Import Duty Rate | Tariff item 8424.89.00