Underfill Dispensing Sprayer for BGA Printed Circuit Packages from United States
A precision jetting system for spraying capillary underfill materials beneath BGA chips on printed circuit boards, preventing delamination during reflow. It is a mechanical projecting appliance designed principally for advanced PCB assembly. This appliance is classified under 8424.89.00 as an 'other appliance' for projecting liquids.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm that the underfill material is declared separately and complies with Canadian regulations
• Provide CBSA with the jetting mechanism details to support classification
• If the system includes a curing oven, consider classification under 84.79