Nanoparticle Slurry Disperser for STI CMP from United States
A high-pressure disperser that projects ceria nanoparticle slurry for shallow trench isolation (STI) chemical mechanical polishing (CMP) in semiconductor manufacturing. It is classified here as an 'other' appliance for projecting or dispersing liquids or powders, not covered by more specific headings.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm whether the disperser is a complete CMP machine or just a dispensing unit — if it performs polishing, it may fall under heading 84.86
• Keep records of the slurry composition to demonstrate the dispersing function
• Check if the equipment requires any electrical safety certifications (e.g
• CSA) before import