CMP Slurry Filtration Pump from Japan
A pump that recirculates filtered chemical-mechanical polishing (CMP) slurry to maintain abrasive particle distribution for uniform wafer polishing. It is specifically designed for semiconductor wafer fabrication, ensuring consistent slurry delivery. This pump is critical for achieving the required surface finish on wafers.
Duty Rate — Japan → Canada
0%
Import Tips
• Document the pump's role in CMP slurry recirculation to justify classification under 8413.81.00
• Include technical data on flow rates and particle control
• Check if the pump is eligible for duty deferral under the Machinery Program if used in manufacturing