Polyimide Copper Clad Laminate for Flex PCBs from United States
Polyimide copper clad laminate for flex PCBs, consisting of a polyimide film backing clad with refined copper foil of 0.15 mm or less. The copper layer provides conductive paths while the polymer backing enables flexibility for flexible printed circuits. This product is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm the copper foil thickness is 0.15 mm or less, excluding the polyimide backing, to meet the tariff item requirements
• Provide the CBSA with a product datasheet specifying the refined copper purity and polyimide film thickness
• If the laminate is imported in rolls, ensure the copper foil thickness is measured consistently across the roll