High-Tg FR4 Copper Clad Laminate from Japan
High-Tg FR4 copper clad laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15 mm. The high-Tg FR4 substrate is a plastics-based backing, making it classifiable under this tariff item.
Duty Rate — Japan → Canada
0%
Import Tips
• Document the high-Tg property and copper foil thickness for CBSA verification
• Ensure the backing is clearly FR4-based
• Check if the product is eligible for duty-free treatment under the Comprehensive Economic and Trade Agreement (CETA)