BT Resin Copper Clad Laminate for IC Substrates from Germany
BT resin copper clad laminate for IC substrates, featuring ultra-thin refined copper foil of 0.15 mm or less on a bismaleimide-triazine resin backing. It is engineered for semiconductor packaging substrates requiring high-density interconnect capability. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.
Duty Rate — Germany → Canada
0%
Import Tips
• Confirm the copper foil thickness is 0.15 mm or less, excluding the BT resin backing, to meet the tariff item definition
• Keep technical documentation showing the refined copper composition (at least 99.85% copper) for CBSA verification
• If the laminate is used in finished semiconductor packages, confirm whether the finished article classification applies instead