Tungsten Silicide Sputtering Target
Tungsten silicide sputtering targets are high-purity, unworked silicide of tungsten used to deposit thin films for CMOS gates in semiconductors. They are classified under 2850.00.00 as silicides before fabrication into wafers.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the target is sold with or as part of semiconductor manufacturing equipment
Machines for semiconductor manufacture are classified in Chapter 84.
If the target contains carbide impurities
Carbides are excluded from heading 28.50.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm the target is unworked and not mounted on a backing plate, as that may change classification
• Provide documentation of purity and density for CBSA
• If the target is part of a sputtering machine, consider Chapter 84
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