Titanium Silicide Sputtering Target Material from China
Titanium silicide sputtering target material is high-purity TiSi2 powder pressed for thin-film deposition in semiconductor manufacturing. It remains classified as titanium silicide under tariff item 2850.00.00 as the chemical compound form. The product is used for silicide gate formation.
Duty Rate — China → Canada
0%
Import Tips
• Classify the product as titanium silicide in powder form, even if pressed
• Provide a description of the pressing process and purity
• The CBSA may require a certificate of analysis to confirm the chemical composition