Prototype Smartphone PCB Assembly from Japan
Printed circuit board assembly for next-generation smartphone prototype used in hardware validation and RF testing. Qualifies under 9817.85.01 as it's pre-production for product evaluation and quality control. Includes processor, memory, and antenna modules.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit engineering change orders and test plans demonstrating prototype development stage
• Label clearly as 'Prototype - Not for Resale' with development project identification
• Obtain binding ruling prior to import for high-value electronics prototypes