Prototype Smartphone PCB Assembly from Japan
Printed circuit board assembly for next-generation smartphone prototype used in hardware validation and RF testing. Qualifies under 9817.85.01 as it's pre-production for product evaluation and quality control. Includes processor, memory, and antenna modules.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit engineering change orders and test plans demonstrating prototype development stage
• Label clearly as 'Prototype - Not for Resale' with development project identification
• Obtain binding ruling prior to import for high-value electronics prototypes