Semiconductor Wafer Processing from Japan
Silicon wafers exported for specialized thin-film deposition and photolithic processing steps before final US chip fabrication. Covered under 9813.00.05 as articles processed abroad contributing to US semiconductor manufacturing. Essential intermediate step in high-tech chip production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Maintain cleanroom transport protocols; document each processing layer specification; use temperature-controlled bonded shipping for wafer integrity