Semiconductor Wafer Processing from Japan
Silicon wafers exported for specialized thin-film deposition and photolithic processing steps before final US chip fabrication. Covered under 9813.00.05 as articles processed abroad contributing to US semiconductor manufacturing. Essential intermediate step in high-tech chip production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Maintain cleanroom transport protocols; document each processing layer specification; use temperature-controlled bonded shipping for wafer integrity