Silicon Wafers for US Semiconductor Fab from Japan
Prime silicon wafers imported for photolithography, etching, and doping into integrated circuits manufactured in US semiconductor foundries. Classifies under 9813.00.05.20 as material processed into US electronic components.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include foundry process flow documentation proving wafer-to-die transformation
• Maintain cleanroom processing records for Customs verification of substantial transformation
• Pre-diced wafers may classify as parts under Chapter 85 rather than processing material