Silicon Wafers for US Semiconductor Fab from Japan
Prime silicon wafers imported for photolithography, etching, and doping into integrated circuits manufactured in US semiconductor foundries. Classifies under 9813.00.05.20 as material processed into US electronic components.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include foundry process flow documentation proving wafer-to-die transformation
• Maintain cleanroom processing records for Customs verification of substantial transformation
• Pre-diced wafers may classify as parts under Chapter 85 rather than processing material