Repaired Semiconductor Wafer Fab Equipment from Japan
Applied Materials wafer etch chamber exported for plasma source repair and chamber refinishing. Returned under 9802.00.50 for semiconductor manufacturing tool service. Statistical: 9802.00.5040-8486.20.0040.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Cleanroom certification post-repair
• Provide etch rate test results
• Duty based on verified service contract value