Repaired Semiconductor Wafer Fab Equipment from Japan
Applied Materials wafer etch chamber exported for plasma source repair and chamber refinishing. Returned under 9802.00.50 for semiconductor manufacturing tool service. Statistical: 9802.00.5040-8486.20.0040.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Cleanroom certification post-repair
• Provide etch rate test results
• Duty based on verified service contract value