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Repaired Semiconductor Wafer Fab Equipment from Japan

Applied Materials wafer etch chamber exported for plasma source repair and chamber refinishing. Returned under 9802.00.50 for semiconductor manufacturing tool service. Statistical: 9802.00.5040-8486.20.0040.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Cleanroom certification post-repair

Provide etch rate test results

Duty based on verified service contract value

Repaired Semiconductor Wafer Fab Equipment from Japan — Import Duty Rate | HTS 9802.00.50