Gold-Plated Lead Frame Scrap from IC Production from Japan
Manufacturing scrap lead frames with gold plating from integrated circuit assembly lines, recycled for precious metal recovery. These electrical waste pieces are defective or trimmed excess. HTS 8549.29.00.00 includes such semiconductor-related scrap.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include fab yield reports showing scrap generation; comply with semiconductor industry cleanroom waste rules; declare palladium content if present