8549.21.00.00/Cadmium-Containing Solder Paste Residue Scrap/Japan

Cadmium-Containing Solder Paste Residue Scrap from Japan

Electronic scrap from manufacturing waste with cadmium in lead-free solder alternatives, for precious metal reclamation. 8549.21.00.00 applies to cadmium-bearing components. SMT production byproduct.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Stabilize paste in sealed containers to prevent leaching; declare Cd concentration accurately; confirm smelter acceptance prior to shipment