Western Digital 128GB 3D TLC NAND Flash IC from China
Triple-level cell 3D NAND flash memory die for high-capacity non-volatile storage in SSDs and embedded systems. HTS 8542.32.00 covers this as a memory-specific electronic integrated circuit.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Declare wafer/die form vs packaged; comply with WEEE directive equivalents; avoid undervaluation penalties common in high-volume chip imports