Kingston KVR26S22S8 DRAM Die from Mexico

Unpackaged silicon die version of 1Gb DDR4 DRAM for custom BGA packaging, capacity over 512Mb not over 1Gb. Classified under 8542.32.00.32 as electronic integrated circuit memory chips. Used in high-volume OEM manufacturing for servers.

Duty Rate — Mexico → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

Import Tips

Ship in wafer trays or die carriers with ESD protection; declare as 'bare dies' to avoid parts confusion

Obtain advance classification rulings for die vs packaged forms to prevent reclassification to 8541

Track total bit capacity precisely as density determines statistical suffix within 8542.32