Kingston KVR26S22S8 DRAM Die from China
Unpackaged silicon die version of 1Gb DDR4 DRAM for custom BGA packaging, capacity over 512Mb not over 1Gb. Classified under 8542.32.00.32 as electronic integrated circuit memory chips. Used in high-volume OEM manufacturing for servers.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Ship in wafer trays or die carriers with ESD protection; declare as 'bare dies' to avoid parts confusion
• Obtain advance classification rulings for die vs packaged forms to prevent reclassification to 8541
• Track total bit capacity precisely as density determines statistical suffix within 8542.32