MEMS Pressure Sensor Wafer from Mexico
200mm silicon wafer with unmounted micro-electro-mechanical systems (MEMS) capacitive pressure sensor dice for automotive tire pressure monitoring systems (TPMS). HTS 8541.59.00.40 applies to semiconductor-based transducer wafers. Each die measures 0-50 psi with integrated signal conditioning.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Include diaphragm dimensions and cavity etch specifications; declare transducer principle (capacitive vs piezoresistive); automotive PPAP documentation recommended