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8541.59.00.40/MEMS Pressure Sensor Wafer/Japan

MEMS Pressure Sensor Wafer from Japan

200mm silicon wafer with unmounted micro-electro-mechanical systems (MEMS) capacitive pressure sensor dice for automotive tire pressure monitoring systems (TPMS). HTS 8541.59.00.40 applies to semiconductor-based transducer wafers. Each die measures 0-50 psi with integrated signal conditioning.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
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Import Tips

• Include diaphragm dimensions and cavity etch specifications; declare transducer principle (capacitive vs piezoresistive); automotive PPAP documentation recommended

MEMS Pressure Sensor Wafer from Japan — Import Duty Rate | HTS 8541.59.00.40