MEMS Pressure Sensor Wafer from China
200mm silicon wafer with unmounted micro-electro-mechanical systems (MEMS) capacitive pressure sensor dice for automotive tire pressure monitoring systems (TPMS). HTS 8541.59.00.40 applies to semiconductor-based transducer wafers. Each die measures 0-50 psi with integrated signal conditioning.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Include diaphragm dimensions and cavity etch specifications; declare transducer principle (capacitive vs piezoresistive); automotive PPAP documentation recommended