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CCD Image Sensor Wafer

Unprocessed silicon wafer containing multiple Charge-Coupled Device (CCD) photosensitive transistor chips for imaging applications. Classified in 8541.49.70.40 as unmounted wafers of photosensitive semiconductor transistors before dicing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+50.0%50%
🇲🇽MexicoFree—Free
🇨🇦CanadaFree—Free
🇩🇪GermanyFree—Free
🇯🇵JapanFree—Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8525.89.50Lower: 37.5% vs 50%

If fully assembled into digital cameras

Complete digital still image cameras or video recorders fall under 8525.89, not raw semiconductor wafers.

8542.32.00Same rate: 50%

If integrated circuit amplifiers rather than discrete transistors

Memory or amplifier ICs classify under 8542.32, separate from discrete photosensitive transistors.

8486.90.00Lower: 25% vs 50%

If for industrial semiconductor manufacturing equipment parts

Semiconductor manufacturing machines parts go to 8486, based on end-use in fab equipment.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Submit wafer maps and test data proving photosensitive transistor functionality for correct HTS verification

• Comply with ITAR/EAR if destined for defense imaging applications

• Avoid classifying diced wafers as finished chips if still on frame; declare as wafers