High-Density Multilayer Smartphone Motherboard PCB from Mexico
8-layer high-density interconnect (HDI) PCB for smartphone motherboards, featuring microvias, blind/buried vias, and fine-pitch BGA pads for processors and modems. Falls under HTS 8534.00.00 as advanced bare printed circuits for mobile device assembly.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide controlled impedance test reports for high-speed signal layers in technical documentation
• Declare layer count and via structure (laser microvias vs. mechanical) to distinguish from simpler boards