High-Density Multilayer Smartphone Motherboard PCB from Germany
8-layer high-density interconnect (HDI) PCB for smartphone motherboards, featuring microvias, blind/buried vias, and fine-pitch BGA pads for processors and modems. Falls under HTS 8534.00.00 as advanced bare printed circuits for mobile device assembly.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide controlled impedance test reports for high-speed signal layers in technical documentation
• Declare layer count and via structure (laser microvias vs. mechanical) to distinguish from simpler boards