High-Density Multilayer Smartphone Motherboard PCB from China
8-layer high-density interconnect (HDI) PCB for smartphone motherboards, featuring microvias, blind/buried vias, and fine-pitch BGA pads for processors and modems. Falls under HTS 8534.00.00 as advanced bare printed circuits for mobile device assembly.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide controlled impedance test reports for high-speed signal layers in technical documentation
• Declare layer count and via structure (laser microvias vs. mechanical) to distinguish from simpler boards