Flexible Printed Circuit Board for Smartphone Display from Japan
A thin, bendable PCB used to connect the display screen to the main board in smartphones. It falls under HTS 8534.00.00.80 as a flexible type printed circuit, distinguished by its ability to bend without breaking, essential for compact foldable or curved-screen devices.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify flexibility through bend radius testing to confirm classification under flexible type, not rigid PCBs
• Include material specs (polyimide substrate) and layer count in documentation to avoid reclassification