8534.00.00.70/ESP32 Development Module PCB/Japan

ESP32 Development Module PCB from Japan

The ESP32 module PCB is a compact, rigid plastic-impregnated printed circuit supporting WiFi and Bluetooth connectivity for IoT applications. It falls under HTS 8534.00.00.70 as an 'other' non-flexible impregnated type, providing traces for the ESP32 chip, antenna, and pins. Ideal for smart home devices and wearables.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document impregnation process and rigidity tests to support 8534.00.00.70 classification

• Label clearly as 'unpopulated PCB' to distinguish from modules with soldered ICs

ESP32 Development Module PCB from Japan — Import Duty Rate | HTS 8534.00.00.70