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8522.90.36.00/Wireless Headphone PCB Mainboard Assembly/Japan

Wireless Headphone PCB Mainboard Assembly from Japan

Main PCB assembly with SoC, memory, RF module, and connectors soldered together for Bluetooth headphones (8519.81.41). Serves as the core processing unit. 8522.90.36.00 classification for fastened multi-part construction.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include firmware specs showing Bluetooth audio codec support

• Declare RoHS compliance and CE markings for electronics