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8522.90.36.00/Wireless Headphone PCB Mainboard Assembly/Japan

Wireless Headphone PCB Mainboard Assembly from Japan

Main PCB assembly with SoC, memory, RF module, and connectors soldered together for Bluetooth headphones (8519.81.41). Serves as the core processing unit. 8522.90.36.00 classification for fastened multi-part construction.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Include firmware specs showing Bluetooth audio codec support

• Declare RoHS compliance and CE markings for electronics

Wireless Headphone PCB Mainboard Assembly from Japan — Import Duty Rate | HTS 8522.90.36.00