Headphone Ear Cup Acoustic Assembly from Japan
Ear cup subassembly with damping foam, driver baffle, and mesh grille fastened for noise-isolating wireless headphones (8519.81.41). Controls sound staging and isolation. Fits 8522.90.36.00 dedicated assembly.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Frequency response curves validating acoustic design
• Material safety data for foams (REACH compliance)