Headphone Ear Cup Acoustic Assembly from Japan
Ear cup subassembly with damping foam, driver baffle, and mesh grille fastened for noise-isolating wireless headphones (8519.81.41). Controls sound staging and isolation. Fits 8522.90.36.00 dedicated assembly.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Frequency response curves validating acoustic design
• Material safety data for foams (REACH compliance)