Headphone Ear Cup Acoustic Assembly from Japan
Ear cup subassembly with damping foam, driver baffle, and mesh grille fastened for noise-isolating wireless headphones (8519.81.41). Controls sound staging and isolation. Fits 8522.90.36.00 dedicated assembly.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Frequency response curves validating acoustic design
• Material safety data for foams (REACH compliance)