QSC K12.2 Amplifier Heat Sink Assembly from Japan
Extruded aluminum heat sink with transistor mounting for QSC K12.2 powered loudspeaker amplifier. Thermal management part under HTS 8518.90.81.00.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Thermal resistance specs confirm amplifier part function
• Anodizing certificates for corrosion resistance
• Distinguish from general computer heat sinks