Polycom Handset PCB Assembly from Japan
Printed circuit board assembly for Polycom line telephone handsets, containing audio processing chips, microphone interfaces, and speaker drivers. Classified under HTS 8518.90.20.00 as a printed circuit assembly specifically for line telephone handsets of subheading 8518.30.10. Essential component handling analog-to-digital conversion for clear voice transmission.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify FCC Part 68 compliance for telecommunication components to avoid import delays
• Include detailed BOM and schematic diagrams in documentation to prove handset-specific function
• Check for ITAR restrictions if assembly includes encryption chips for secure communications