8518.90.20.00/Polycom Handset PCB Assembly/Japan

Polycom Handset PCB Assembly from Japan

Printed circuit board assembly for Polycom line telephone handsets, containing audio processing chips, microphone interfaces, and speaker drivers. Classified under HTS 8518.90.20.00 as a printed circuit assembly specifically for line telephone handsets of subheading 8518.30.10. Essential component handling analog-to-digital conversion for clear voice transmission.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Verify FCC Part 68 compliance for telecommunication components to avoid import delays

• Include detailed BOM and schematic diagrams in documentation to prove handset-specific function

• Check for ITAR restrictions if assembly includes encryption chips for secure communications