Nordson ASYMTEK Ultrasonic Solder Pot from Japan
Benchtop ultrasonic soldering system for drag soldering SMD components using 40kHz vibration to wet difficult surfaces without flux. Under HTS 8515.80.00 as ultrasonic soldering apparatus for electronics rework and prototype assembly. Handles aluminum, glass, and chipboard soldering.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify soldering temperature range and pot capacity
• Lead-free solder compliance documentation
• Electronics rework vs production distinction