Thermaltronics C50 Desktop Reflow Oven from Japan
Thermaltronics C50 is a compact desktop reflow soldering oven for prototype PCB assembly using forced hot air convection. Falls under HTS 8515.19.00.00 as electric reflow soldering apparatus for surface mount technology. Features 8-zone temperature profiling.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include complete reflow profile programming capabilities documentation
• Specify convection heating system technical parameters
• Verify compliance with IPC-7530 convection reflow standards