Dielectric Preheater for Wood Glue from Japan
Equipment using dielectric loss to preheat moisture-laden wood glue for faster curing in furniture manufacturing. High-frequency fields penetrate materials for uniform heating. Fits 8514.40.00.00 for dielectric heat treatment applications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify glue moisture content ranges for classification support
• RF exposure safety data mandatory for customs clearance
• Avoid describing as 'gluing machine' to prevent 8465 classification