Dielectric Preheater for Wood Glue from Japan
Equipment using dielectric loss to preheat moisture-laden wood glue for faster curing in furniture manufacturing. High-frequency fields penetrate materials for uniform heating. Fits 8514.40.00.00 for dielectric heat treatment applications.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify glue moisture content ranges for classification support
• RF exposure safety data mandatory for customs clearance
• Avoid describing as 'gluing machine' to prevent 8465 classification