Dielectric Preheating Unit for Adhesives from Japan
Lab unit accelerating adhesive curing through dielectric heating of polar molecules. Used in bonding research for composites. Fits HTS 8514.20.80.00 dielectric equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document adhesive viscosity reduction curves vs. frequency
• Ensure applicator compatibility certification for various substrates
• Distinguish from hot melt applicators (8424.89) by dielectric mechanism