Dielectric Preheating Unit for Adhesives from Japan
Lab unit accelerating adhesive curing through dielectric heating of polar molecules. Used in bonding research for composites. Fits HTS 8514.20.80.00 dielectric equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document adhesive viscosity reduction curves vs. frequency
• Ensure applicator compatibility certification for various substrates
• Distinguish from hot melt applicators (8424.89) by dielectric mechanism