Dielectric Preheating Unit for Adhesives from Canada
Lab unit accelerating adhesive curing through dielectric heating of polar molecules. Used in bonding research for composites. Fits HTS 8514.20.80.00 dielectric equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document adhesive viscosity reduction curves vs. frequency
• Ensure applicator compatibility certification for various substrates
• Distinguish from hot melt applicators (8424.89) by dielectric mechanism