Wafer Edge Grinder from China
Machine that grinds wafer edges to precise chamfer profiles, preventing chipping during handling and processing. Specified in HTS 8486.40.00 under note 11(C) wafer preparation equipment. Critical for 300mm+ wafer handling in modern fabs.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify edge profiling geometries (e.g
• full bevel, half chisel) matching semiconductor standards
• Document wafer sizes handled (150-450mm) to distinguish from smaller precision grinding
• Include throughput specs demonstrating fab-scale production capacity