Silicon Ingot Grinder from China
Precision grinder for shaping silicon ingots to uniform diameter prior to wafer slicing, with automatic flat generation. HTS 8486.40.00 under note 11(C)(ii)(A) boule grinding equipment. Handles 8-12 inch diameter semiconductor ingots.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Include ingot diameter range and flat positioning accuracy specifications
• Provide evidence of semiconductor crystal handling (vacuum chucking)
• Document integration with slicing saw transfer systems