Semiconductor Wafer Slicing Saw from Mexico
High-precision inner-diameter saw that slices ultra-thin wafers (25-775 microns) from monocrystalline semiconductor boules while minimizing subsurface damage. HTS 8486.40.00 per note 11(C)(ii)(B) for wafer manufacturing equipment. Uses diamond-impregnated blades optimized for silicon/gallium arsenide.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Provide blade specifications (ID saw, diamond wire) and achievable wafer thickness to validate classification
• Include cleanroom compatibility certification as evidence of semiconductor fabrication use
• Prevent reclassification by documenting exclusive use for monocrystalline semiconductor slicing