Semiconductor Wafer Slicing Saw from China
High-precision inner-diameter saw that slices ultra-thin wafers (25-775 microns) from monocrystalline semiconductor boules while minimizing subsurface damage. HTS 8486.40.00 per note 11(C)(ii)(B) for wafer manufacturing equipment. Uses diamond-impregnated blades optimized for silicon/gallium arsenide.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide blade specifications (ID saw, diamond wire) and achievable wafer thickness to validate classification
• Include cleanroom compatibility certification as evidence of semiconductor fabrication use
• Prevent reclassification by documenting exclusive use for monocrystalline semiconductor slicing