Double-Sided Wafer Lapper from Mexico
Simultaneous double-sided lapping machine that achieves wafer parallelism within 1 micron for semiconductor processing. HTS 8486.40.00 per note 11(C)(ii)(C) for wafer preparation. Uses cast iron plates with diamond slurry for silicon/gallium arsenide wafers.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Provide flatness/taper specifications (sub-micron) proving semiconductor wafer tolerances
• Include slurry delivery systems documentation showing semiconductor-specific chemistry
• Distinguish from metallographic lappers by wafer batch capacity (25-50 wafers)