Double-Sided Wafer Lapper from China
Simultaneous double-sided lapping machine that achieves wafer parallelism within 1 micron for semiconductor processing. HTS 8486.40.00 per note 11(C)(ii)(C) for wafer preparation. Uses cast iron plates with diamond slurry for silicon/gallium arsenide wafers.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Provide flatness/taper specifications (sub-micron) proving semiconductor wafer tolerances
• Include slurry delivery systems documentation showing semiconductor-specific chemistry
• Distinguish from metallographic lappers by wafer batch capacity (25-50 wafers)